Latest technology

Flexible printed circuit boards are the method of choice when working with complex geometries.

Space, weight and cost savings as well as increased reliability of the electrical connections are just some of the benefits of flexible PCBs.


Flexible PCBs in the Flex-POOL: The minimum area, from which the base price is calculated is 1 dm². In the Flex-Pool a maximum of 5 dm² area is possible. The calculation of your Flex-PCB can be done quite easily using our price calculator. For larger quantities and PCBs using different techniques, which are not produced by us in the Flex-POOL, we are happy to have an offer calculated for your.

Base material

Only polyimide foils are used as base material, which provide different benefits compared to other foils, differing substantially from rigid PCB materials. If needed, download our data sheet.

Properties Polyimide
Copper adhesion ≥ 0.70 N/mm2
Dielectric constant ≤ 3.7 (1 GHz)
Resistance in the solder bath 288°C (> 10 s)
Expansion ± 0.20 %

In the Flex-POOL a coverbased Kapton®- /Acrylic is used, which, for example, ensures higher dielectric strength.

Technical parameter

Number of layers 1 - 2
Copper Electroless Nickel Immersion Gold (ENIG)
Surface Chemical Tin
Foil material Polyimide
Polyimide thickness 50 μm
Copper thickness 18 µm 
PCB thickness 0.2 mm
Maximum size of the PCB Length: 400 mm / Width: 250 mm
Minimum size of the PCB Length: 10 mm / Width: 10 mm
Flex cover foil Relief cut: 200 μm
Minimum conductor width / conductor distance 150 μm
Vias Via diameter: 300 μm
Minimum distance Via-Via 450 μm
Minimal cutting radius 100 μm
Minimum distance copper contour 300 μm
Contour tolerance +/- 200 μm
Silkscreen both sides

If needed, download our data sheet here data sheet.


Before the component placement and the soldering process the flexible PCBs must be dried. Thereafter they have to be processed within 8 hours.

Please refer to the data sheet "Drying (tempering) PCBs".

Layout recommendations

Please note: If your enhancing material does not touch the edges of the PCB (for example, a connector) please request a quote from us.

  • Bending radius is approx. 6 x flex material thickness for one-sided flex layers and approx. 12 x flex material thickness for double-sided flex layers
  • Select the largest possible track widths and clearances in the flex area
  • Bending area should have parallel, equal track widths having the same insulation resistance, which run perpendicular to the bending line
  • Continuously tapered transitions from wide to narrow circuit paths are ideal
  • Transitions from wide to narrow circuit paths at a 90° angle should be as large a radii that can be realised.
  • The tracks on double-sided flexible components should be symmetrically offset
  • Provide large, cut-out Cu surfaces in the layout if possible
  • Select soldering surfaces to be as large as possible - select soldering pad diameters at least twice as large as the hole diameters
  • Design track connections to the soldering pads to be droplet-shaped and rounded.
  • Make cover film openings which are not photo-structured to be around 1 mm larger in circumference
  • Always provide smooth (round) milling transitions
  • Provide additional copper tracks as tear protection on the target bending points for flexible jibs
  • Partial mechanical reinforcements can be added in the mating or assembly areas (thickness: 0.3 mm).