Flexible printed circuit boards are the method of choice when working with complex geometries.
Space, weight and cost savings as well as increased reliability of the electrical connections are just some of the benefits of flexible PCBs.
Flexible PCBs in the Flex-POOL:
The minimum area, from which the base price is calculated is 1 dm².
In the Flex-Pool a maximum of 5 dm² area is possible.
The calculation of your Flex-PCB can be done quite easily using our price calculator.
For larger quantities and PCBs using different techniques, which are not produced by us in the Flex-POOL, we are happy to have an offer calculated for your.
Only polyimide foils are used as base material, which provide different benefits compared to other foils, differing substantially from rigid PCB materials. If needed, download our data sheet.
||≥ 0.70 N/mm2
||≤ 3.7 (1 GHz)
|Resistance in the solder bath
||288°C (> 10 s)
||± 0.20 %
In the Flex-POOL a coverbased Kapton®- /Acrylic is used, which, for example, ensures higher dielectric strength.
|Number of layers
||1 - 2
||Electroless Nickel Immersion Gold (ENIG)
|Maximum size of the PCB
||Length: 400 mm / Width: 250 mm
|Minimum size of the PCB
||Length: 10 mm / Width: 10 mm
|Flex cover foil
||Relief cut: 200 μm
|Minimum conductor width / conductor distance
||Via diameter: 300 μm
|Minimum distance Via-Via
|Minimal cutting radius
|Minimum distance copper contour
||+/- 200 μm
If needed, download our data sheet here data sheet.
Before the component placement and the soldering process the flexible PCBs must be dried. Thereafter they have to be processed within 8 hours.
Please refer to the data sheet "Drying (tempering) PCBs".
Please note: If your enhancing material does not touch the edges of the PCB (for example, a connector) please request a quote from us.
- Bending radius is approx. 6 x flex material thickness for one-sided flex layers and approx. 12 x flex material thickness for double-sided flex layers
- Select the largest possible track widths and clearances in the flex area
- Bending area should have parallel, equal track widths having the same insulation resistance, which run perpendicular to the bending line
- Continuously tapered transitions from wide to narrow circuit paths are ideal
- Transitions from wide to narrow circuit paths at a 90° angle should be as large a radii that can be realised.
- The tracks on double-sided flexible components should be symmetrically offset
- Provide large, cut-out Cu surfaces in the layout if possible
- Select soldering surfaces to be as large as possible - select soldering pad diameters at least twice as large as the hole diameters
- Design track connections to the soldering pads to be droplet-shaped and rounded.
- Make cover film openings which are not photo-structured to be around 1 mm larger in circumference
- Always provide smooth (round) milling transitions
- Provide additional copper tracks as tear protection on the target bending points for flexible jibs
- Partial mechanical reinforcements can be added in the mating or assembly areas (thickness: 0.3 mm).